Test
Tools
- Market
Intelligence
- GSA Ecosystem
Company Index
- Test Capacity
Working Group
Test
Statement of Challenges
- Cost-of-test (COT) models used throughout the industry are widely varying and often produce conflicting results
- Design-for-test (DFT) costs and associated tradeoffs are not accurately included in most COT models
- Test capacity management processes and tools do not sufficiently account for the inherent variability of test capacity
- Shrinking product life cycles make alignment of test-related deliverables like tester selection, yield-learning, test coverage, etc., increasingly difficult.
- Advancing chip integration technologies create a test development bottleneck when combining test solutions for analog, digital, RF, power management, and other technologies
Mission
Identify and address test industry issues (primarily from an outsourced services perspective) and enable solutions that allow customers to efficiently meet cost and product introduction goals.
Objectives
- Develop and publish a realistic COT model that deploys an industry “best practices” benchmark approach and provides a reference for proprietary models.
- Investigate and publish more details relating to the challenges of test capacity management with the goal of identifying and developing potential solutions
Get Involved/Working Groups
Steven Slupsky, Co-Founder, President, & CEO, Scanimetrics, chairs the Test Interest Group. Dan Hamling, Director, Test and Assembly, GE Global Electronics Services, chairs the Test Capacity Working Group. For more information on how to get involved with either group, contact Kristen Pillans at 972.866.7579 ext. 124 or via email at kpillans@gsaglobal.org .
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

Tools
SURVEYS
Wafer Fabrication & Back-End Pricing
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This survey is intended to create a quarterly benchmark for the fabless and IDM sectors, depicting average wafer, mask set, assembly, test and wafer bump prices by company type, region, etc. The data is collected confidentially and tabulated in aggregate by Grant Thornton LLP using a weighted industry average approach.
In exchange for completing the Survey online, you will receive complimentary access to the Wafer Fabrication and Back-End Pricing Reports ($3,000 annual value), analyzing the average wafer, mask set, assembly, test and wafer bump costs for each quarter in which you participate.
GSA Interest Group Survey
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GSA's Interest Groups are driving industry solutions in EDA/Design, IP, Wafer Manufacturing, Packaging and Test. Help us by giving your feedback in these areas.
Suppliers and Service Partners
Semiconductor End Markets
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It is well known that the semiconductor industry changes rapidly; therefore, GSA surveys its database of companies regularly to ensure all information is updated and correct. This year, we are sending an abbreviated survey to capture your company’s detailed end market information.
By completing the survey, it will guarantee your company is listed correctly in our database, which, in turn, will help us serve you better.
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REPORTS
2010 GSA Memory Conference Report
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“Bridging Memory and Logic ICs for Better System Performance”
The GSA Memory Conference, held in Taipei on March 16, 2010, ended with great success. The 2010 GSA Memory Conference Report records the key perspectives and insights from the distinguished speakers and the companies they represented at this conference. It also brings together impartial views and comments from the Industrial Economics and Knowledge Center (IEK), the industrial research arm of the Industrial Technology Research Institute (ITRI), a long-term associate to GSA.
Global Semiconductor Funding, IPO and M&A Update
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To provide the industry with timely data on semiconductor investment activity in the private and public sector, GSA releases a monthly two-page update and a downloadable, sort-able Excel spreadsheet of all semiconductor funding, initial public offering (IPO), and merger and acquisition (M&A) activity.
Global Semiconductor Financial Tracker
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GSA's quarterly Global Semiconductor Financial Report is a comprehensive report, which includes detailed trend analysis, regional breakdowns, etc. on financial data.
This report is complimentary to GSA members. Non-members may purchase it at the GSA Store.
Wafer Fabrication & Back-End Pricing Report
India Semiconductor Market Research Reports
Understanding the Needs & Perceptions of SOI Technology: Silicon-on-Insulator Survey Analysis
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Given the critical low-power and high-performance needs in the semiconductor industry today, Silicon-on-Insulator (SOI) technology may become an enabler to companies attempting to meet these requirements, especially at more advanced nodes. GSA hosted the survey to better understand the needs and perceptions of SOI from users within the industry.
Lead-Free Resources
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GSA provides you resources including presentations, reports and links to additional sites with helpful information such as defining RoHS, WEEE, lead facts, and more.
Building a Better Supply Chain: Successful Collaboration in the Fabless Semiconductor Industry
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Industry Directions and GSA
A collaborative effort between industry analyst firm Industry Directions, Inc. and GSA, the study demonstrates that while fabless companies are adept at operating in the outsourced model and recognize the importance of the supply chain and how it helps drive competitive advantage, there is significant opportunity for improvement.
GSA Semiconductor Market Report: An Essential Data Resource for Outsourcing Companies
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The Semiconductor Market Report, last updated in May 2007, is an essential historical data resource that encompasses the entire fabless ecosystem. There is no single source or publication of this caliber with the more than 550 pages of easy-to-read charts, graphs and written analysis.
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ARTICLES
The Sure Path to 40nm Success
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Virage Logic
Virage Logic
PDF, 144 KB
Can MIPI and MDDI Really Co-Exist?
Current Economic Downturn Monitor
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Throughout the current economic downturn, GSA is providing the industry with the latest data, resources and analysis supporting the GSA Hypothesis. We encourage you to download the articles and presentations for the most comprehensive analysis.
Moving Beyond IEEE 1149.1
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Steve Scheiber, Contributing Technical Editor
Test & Measurement World
PDF, 170 KB
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PRESENTATIONS
IP Conference Taiwan
Hsinchu, Taiwan May 7, 2009
ITAC and GSA Conference
Waterloo, Ontario, CANADA April 15, 2009
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Semiconductor Industry Will Innovate its Way Out of the Downturn
Lisa Tafoya, Vice President of Global Research
Global Semiconductor Alliance
The semiconductor industry has a rich tradition of managing through dramatic and unforgiving cycles,
ranging from years of extraordinary growth, to steep declines. After several unprecedented years of
contiguous growth, the industry is now facing a downturn stunning even industry veterans.
Semiconductor companies will not go unscathed in this current environment. Start-ups needing
additional rounds of funding and do not yet have a product and are not cash-flow positive are the most
vulnerable. However, in general, the industry is in a much stronger position to weather this downturn
than it was in 2001. The presentation will provide data and analysis supporting the hypothesis that the
semiconductor industry will innovate its way out of the downturn, and how great companies will be
prepared for next-generation opportunities.
PDF, 4.35 MB
GSA Suppliers Expo & Conference
Santa Slara, CA October 2, 2008
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GSA Annual Briefing
LOGIN
GSA
PDF, 1.6 MB
FSA Semiconductor Leaders Forum
Taipei, Taiwan November 7, 2007
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The New Paradigm and Challenge of the Semiconductor Test Industry
LOGIN
Dr. C Y Lu, Chairman and Chief Executive Officer, Ardentec; President, Macronix International Co.
Macronix International Co.
PDF, 1.6 MB
FSA Suppliers Expo & Conference
Santa Clara, California, US September 12, 2007
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FSA Annual Briefing
LOGIN
Jodi Shelton, Executive Director, FSA
FSA
PDF, 2 MB
SEMICON West 2007
July 19, 2007
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Test, Assembly & Packaging TECHXPOT
Panel Discussion: Test - Test – A Gating Factor for Success at Advanced Nodes – A Supply Chain Perspective
LOGIN
Moderator: Tim Cheng, Chair of Department of EE and CS, University of California
University of California
PDF, 144 KB
IET & FSA International Semiconductor Forum
Paris, France May 15, 2007
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Technical Theme: Implementing Emerging Technology
Asynchronous Circuits Adopted: Lessons Learned
LOGIN
Ad Peeters, CTO, Handshake Solutions
Handshake Solutions
PDF, 1.36 MB
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WHITEPAPERS
Supply Chain Issues In The High-Technology Semiconductor Industry
No Government Bailout for Poor Test Planning
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LOGIN
Ron Press, Technical Marketing Manager, Silicon Test and Yield Analysis Product Line
Mentor Graphics
PDF, 1.08 MB
Test Goes Software-Defined
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LOGIN
National Instruments
PDF
The Emergence of Intelligent Operations Management (IOM)
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LOGIN
Bob Parker
Manufacturing organizations in the electronics value chain are seeking to harvest value from the information they have and to harmonize processes and utilize the expertise of their trading partners. The information technology required to support these efforts demands a new kind of application with a modern architecture. For value chain management, this will be the IOM platform.
PDF, 339 KB
Offshoring in the Semiconductor Industry: A Historical Perspective
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LOGIN
Clair Brown and Greg Linden
UC Berkeley
PDF, 244 KB
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GSA Ecosystem Company Index
GSA is pleased to bring you the GSA Ecosystem Company Index. In an effort to provide the industry with timely information, the GSA Ecosystem Company Indexes provide the supply chain with a listing of companies.
Only Test companies are listed on this page. Go to the main GSA Ecosystem Company Index page for the full list.
As a complimentary feature on the GSA site, we encourage all semiconductor supply chain professionals to add their listing. Go to the Company Index Form to create or update your existing record.
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BroadPak Corporation
3375 Scott Blvd. Suite 105
Santa Clara
, CA
95054
USA
www.broadpak.com
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Capital Ideas
3931 Jefferson Ave
Woodside
, CA
94062
USA
www.capital-ideas.com
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Capovani Brothers Inc.
704 Corporations Park
Scotia
, NY
12302
USA
www.capovani.com
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DA-Integrated
3 Iber Rd
Ottawa
, Ontario
K2S 1E6
Canada
da-integrated.com
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E.K.S.S. Microelectronics Ltd.
P.O.B 373
Timrat
, Israel
36576
Israel
www.ekss.co.il
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eBeam Initiative
4040 Moorpark Avenue #250
San Jose
, CA
95117
USA
www.ebeam.org
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eInfochips
1230 Midas Way, Suite# 200
Sunnyvale
, California
94085
USA
http://www.einfochips.com
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Enigma Interconnect Inc.
8070 Winston Street
Burnaby
, BC
V5A2H5
Canada
www.enigmacorp.com
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Evans Analytical Group
810 Kifer Road
Sunnyvale
, ca
94086
USA
www.eaglabs.com
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Galaxy Semiconductor Inc.
371 Moody St., Suite 108
Waltham
, MA
02453
United States
www.galaxysemi.com
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Infotech Enterprises Ltd.,
Plot No.11 Software Units Layout Infocity, Madhapur
Hyderabad
, Andhra Pradesh
500 081
India
http://www.infotech-enterprises.com
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Key ASIC
3900 Freedom Circle Suite 101
Santa Clara
, CA
95054
USA
www.keyasic.com
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Landshut Silicon Foundry GmbH LFOUNDRY
Jenaer Straße 1
Landshut
, Bavaria
84032
GERMANY
www.lfoundry.com
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Maxtek Components Corporation
2905 SW Hocken Avenue
Beaverton
, OR
97005
USA
www.maxtek.com
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NeST
4511 Singer Court
STE 201
Chantilly
, VA
20151
USA
www.nestsoftware.com
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Neugen, Inc.
13640 SW Wrightwood Court
Tigard
, Oregon
97224
USA
http://www.neugen.com
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OptimalTest
18 Einstein Street
Nes Ziona
, Israel
74140
Israel
www.optimaltest.com
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Perfectus Technology
Santa Clara
, California
95054
USA
www.perfectus.com
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Pintail Technologies
5700 Granite Parkway #200
Plano
, TX
75024
US
www.pintail.com
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Prequel, Inc.
1884 Paseo del Cajon
Pleasanton
, CA
94566
USA
www.prequelinc.com
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Presto Engineering, Inc.
3907 North First Street
San Jose
, CA
95134
USA
www.presto-eng.com
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Sofics BVBA
Brugse Baan, 188a
Gistel
, not applicable
8470
Belgium
www.sofics.com
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SPEL Semiconductor Limited
5, CMDA Industrial Estate
Maraimalai Nagar
Chennai
, Tamil Nadu
603209
India
www.spel.com
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Success Recruitment Group
11 The Enterprise Centre
Coxbridge Business Park
Farnham
, Surrey
GU10 5EH
United Kingdom
http://www.successrecruitmentgroup.com/
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Test Spectrum, Inc.
9701 Brodie Lane
Suite 101
Austin
, TX
78748
USA
www.testspectrum.com
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UbiMOS Technologies Inc.
3907 North First Street
San Jose
, CA
95134
USA
www.ubimos.com
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Virage Logic
47100 Bayside Parkway
Fremont
, CA
94538
United States of America
www.viragelogic.com
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Whizz Systems, Inc.
3140 Alfred St.
Santa Clara
, CA
95054
USA
www.whizzsystems.com
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Test Capacity Working Group
Purpose
The purpose of the Test Capacity Working Group (TCWG) is to raise an awareness of the key issues associated with test capacity management by tapping into the valuable experience and insight of the leaders in the test community.
Members
The goal is for the TCWG to be comprised of leaders from the test community who recognize the challenges with managing semiconductor test capacity and are interested in sharing ideas and solutions regarding these challenges. TCWG membership will therefore include thought leaders from across the entire semiconductor test community: test specifiers, test providers, test equipment suppliers, test supply chain solution providers, and anyone else who has experience with test capacity challenges. The breadth and depth of the TCWG membership will therefore provide a comprehensive view of the trends and challenges of semiconductor test capacity management.
Benefits
As a key leader and decision-maker in the semiconductor test industry, your participation on the TCWG provides you the opportunity to:
- Augment reputation as a thought leader in the semiconductor test industry
- Share expertise on the semiconductor test business model and trends
- Shape solutions to the challenges of test capacity management
Initiatives
Test Capacity Survey/Report – The TCWG is working to develop and distribute a survey and report that will help semiconductor companies gain a better knowledge and understanding of the trends and challenges of semiconductor test capacity management.
Deliverables
Test Capacity Survey/Report – Target delivery of inaugural survey: Q4 2010
Leadership
Dan Hamling, Test Capacity Working Group Chairman
Director, Test and Assembly, GE Global Electronics Services
dan.hamling@ge.com
858.320.7319
Kristen Pillans
GSA Research
kpillans@gsaglobal.org
972.866.7579 ext. 124
GSA Test Blog
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Welcome to the GSA Test Blog
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