GSA Member Login | July 29, 2010
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GSA Membership

Members include companies from throughout the supply chain including fabless companies, IDMs, semiconductor suppliers, venture capital firms, investment banking firms, and organizations. Membership has continued to grow substantially each year. Apply Today!

Membership Overview

Click here for the GSA Membership Overview. The overview is an interactive Flash presentation with audio. The presentation is 6 MB and will take a moment to load.

Membership Categories

Semiconductor Membership

This membership is open to all semiconductor companies including fabless, fab-lite and IDMs. This category of membership is based on revenues. GSA provides special leadership opportunities such as voting privileges and participation on its Board of Directors.

Annual Revenues $0-$5M $5-$20M $20-$50M $50-$100M $100M-$500M $500M+
Annual Dues (USD) $2,500 $5,000 $10,000 $15,000 $20,000 $25,000

Partner Memberships

This membership is open to companies who support GSA’s overall goals and mission and provide products and services that enable an environment for growth of the global semiconductor industry.

Supplier Partner Membership

This membership is open to all suppliers to the semiconductor industry including providers of IP, electronic design automation (EDA), wafer manufacturing, assembly & packaging, and test services.

Years in Existence Annual Dues
Start-Up Supplier (0-3 years) $2,500
Supplier (3 years or greater) $5,500

Service Partner Membership

This membership is open to companies who provide services to semiconductor companies including venture capital companies, investment banks, consulting/research, law firms, executive search groups, and insurance companies. Annual dues are USD $5,500.

Organizations/Associations/Government and Educational Partner Membership

This membership is open to organizations, associations, government entities, and educational institutions. Annual dues are USD $3,500.

For more information, please contact Nicole Tidwell at 972.866.7579 x 134 or ntidwell@gsaglobal.org.

Membership Benefits

GSA promotes collaboration, integration and innovation within the global semiconductor industry. A hallmark for our organization has been to identify and articulate market opportunities and address the challenges inherent in a complex value chain to enable industry-wide solutions. We are steadfast in our goal of providing our members a platform for meaningful global collaboration and provide members with comprehensive and unique market intelligence. We have a well-earned reputation for catering to the unique needs of each member company and providing a vast number of tools and services.

GSA provides an array of Member Services:

For more information, please contact Nicole Tidwell at 1.888.322.5195 x 134 or ntidwell@gsaglobal.org.

GSA Members

All GSA Members are shown below. To view by members by category, click on the designated link to be directed to that member section.

* GSA member supplier company appearing in both semiconductor and supplier lists.

Semiconductor Members

Abound Logic ACCO Semiconductor Achronix Semiconductor Corporation
Actel Corporation Actions Semiconductor Co. Ltd. ADD Semiconductor
Advanced Analogic Technology Inc. (AnalogicTech) Advanced Micro Devices, Inc. (AMD) Advanced Semiconductor Engineering, Inc. (ASE Group) *
Aeroflex Colorado Springs Akros Silicon, Inc. Alereon Inc.
Altera Corporation Alvand Technologies, Inc. * Amalfi Semiconductor
Ambarella, Inc. AMIMON Inc. Amkor Technology, Inc. *
Analog Devices, Inc. (ADI) Analogix Semiconductor, Inc. Apexone Microelectronics Inc.
AppliedMicro AppoTech Limited Aptina Imaging
Aquantia Corporation ARM * Atheros Communications, Inc.
Atmel Corporation Audience Inc. austriamicrosystems AG
AuthenTec, Inc. Avago Technologies Availink Inc.
Bay Microsystems, Inc. BeSang Inc. Brite Semiconductor (Shanghai) Corporation
Broadcom Corporation C2 Microsystems, Inc. Cadence Design Systems, Inc. *
CamSemi Ltd. Canesta, Inc. Canova Tech Srl
Cavium Networks CEC HuaDa Electronic Design Co., Ltd (HED) CEITEC S.A.
CHiL Semiconductor, Inc. Chingis Technology Corporation Conexant Systems, Inc.
Cortina Systems Cpacket Networks Crocus Technology SA
Crossbar CSR Plc Custom Silicon Solutions, Inc. (CSS)
Cyan Holdings Plc (Cyan Technology Ltd.) Cypress Semiconductor Corporation Datang Microelectronics Technology Co., Ltd (DMT)
Design of Systems On Silicon (DS2) Dialog Semiconductor DiBcom (Digital Broadband Communications)
Discera, Inc. DisplayLink DSP Group, Inc.
Elonics Ltd EMemory Technology Inc. (EMTC) * Entropic Communications Inc.
eSilicon Corporation Etron Technology, Inc. Exar Corporation
Flexion Semiconductor, Inc. FocalTech Systems Company Ltd. Fresco Microchip Inc.
Frontier Silicon Fulcrum Microsystems Inc. Gennum Corporation
Geo Semiconductor Inc. GigaDevice Semiconductor Inc. Gigle Networks
GigOptix Inc. Global Unichip Corporation (GUC) GLOBALFOUNDRIES *
Himax Technologies, Inc. HiSilicon Technologies Co., Ltd. Holtek Semiconductor Inc.
Hynix Semiconductor Inc. (HSI) IBM Icera Inc.
Ikanos Communications, Inc. Impinj, Inc. INCIDE, S.A.
Infineon Technologies AG Innovasic Semiconductor Innovision Research & Technology Plc
Inphi Corporation Integrated Device Technology (IDT) Integrated Silicon Solution, Inc. (ISSI)
Intel Corporation International Rectifier Intersil Corporation
IPextreme * iWatt, Inc. Jennic, Ltd.
JSC Mikron Kalray Key ASIC, Inc.
L-3 Communications, Infrared Products Lantiq Beteiligungs GmbH & Co. KG Legend Silicon Corporation
LSI Corporation Macronix International Co., Ltd. (MXIC) MagnaChip Semiconductor, Inc.
Marvell Semiconductor, Inc. MediaTek Inc. Mellanox Technologies, Inc.
Micronas Semiconductor Holding AG (Micronas Group) Microsemi Corporation Mindspeed Technologies, Inc.
Mirics Semiconductor Limited MosChip Semiconductor Technology MoSys, Inc.
MSilica Incorporated MStar Semiconductor, Inc. Multigig, Inc.
N-Trig Ltd. Nanoradio AB Nethra Imaging Inc.
NetLogic Microsystems, Inc. Netronome Systems, Inc. Newport Media, Inc.
Nordic Semiconductor ASA Novatek Microelectronics Corporation Novelda AS
Numonyx B.V. NVIDIA Corporation NXP Semiconductors
Octasic, Inc. ON Semiconductor OneChip Photonics Inc.
Open-Silicon, Inc. Optichron Inc. Parade Technologies, Ltd.
ParkerVision, Inc. Phison Electronics Corp. PicoChip Designs Limited
Pixelworks, Inc. Pixim, Inc. Plessey Semiconductors Limited
Plurality Ltd. PLX Technology, Inc. PMC-Sierra, Inc.
Powervation Ltd. Pulse-Link Inc. Pulsus Technologies Inc.
QP Semiconductor, Inc., An E2v Company QUALCOMM Quantenna Communications, Inc.
QuickLogic Corporation QuickSil Inc. Quintic Corporation
RedMere RF Micro Devices (RFMD) RFaxis
Richtek Technology Corporation Ridgetop Group, Inc. Samsung Electronics Co., Ltd.
Sand 9, Inc. SanDisk Corporation Scintera Networks, Inc.
Shanghai Huahong Integrated Circuit Co., (SHHIC) SiBEAM, Inc. SiGe Semiconductor, Inc.
Sigma Designs, Inc. Silicon Laboratories Silicon Mitus, Inc.
Silicon Motion Silicon Standard Corporation Silicon360 *
SiliconBlue Technologies Corporation Siliconware USA, Inc. * SiPort Inc.
SiTel Semiconductor B.V. Skyworks Solutions, Inc. Spreadtrum Communications Inc.
Standard Microsystems Corporation (SMSC) STATS ChipPAC Ltd. * STMicroelectronics
Summit Microelectronics, Inc. Sunplus Technology Company Symwave
Syndiant Synopsys, Inc. * Tabula, Inc.
Taiwan Semiconductor Manufacturing Corporation (TSMC) * Tekmos Telegent Systems
Teradici Corporation Teranetics Terax Communication Technologies
THine Electronics, Inc. Tilera Corporation TM Technology Inc. (TMTECH)
Toshiba America Electronic Components, Inc. TranSwitch Corporation Trident Microsystems, Inc.
Triune Systems LLC Ubicom, Inc. Union Semiconductor Inc.
United Microelectronics Corporation (UMC) * VeriSilicon, Inc. * VIA Technologies, Inc.
Vimicro International Corporation Virage Logic Corporation * Virtus Advanced Sensors
Vitesse Semiconductor Corporation ViXS Systems, Inc. VoiceOn
Volterra Semiconductor Corporation Weltrend Semiconductor, Inc. Wintegra, Inc.
WiSpry, Inc. Wolfson Microelectronics Xelerated AB
Xilinx, Inc. XMOS Semiconductor Ltd. Zoran Corporation

Supplier Partner Members

AccelerATE Solutions Inc. Advanced Semiconductor Engineering, Inc. (ASE Group) * Advantest Corporation
Alchip Technologies Altis Semiconductor Alvand Technologies, Inc. *
Amkor Technology, Inc. * Ansem N.V. Apache Design Solutions, Inc.
Ardentec Corp. ARM * Aspex Semiconductor Ltd
Atrenta, Inc. Cadence Design Systems, Inc. * Cambridge Analog Technologies, Inc. (CAT)
Cavendish Kinetics, Inc. Certicom Corp. ChipStart
Cosmic Circuits Pvt. Ltd. CSMC Technologies Corporation Cymbet Corporation
DA-Integrated Dai Nippon Printing (DNP) Electronic Device Operations DALSA Semiconductor, Inc.
DELTA Microelectronics, Ltd. Denali Software, Inc. Design Rivers
DOLPHIN Integration Dongbu HiTek Co., Ltd. EMemory Technology Inc. (EMTC) *
Emulation & Verification Engineering (EVE SA) EquipIC Evans Analytical Group
Galaxy Semiconductor GLOBALFOUNDRIES * Grace Semiconductor Manufacturing Corp (GSMC)
Gradient Design Automation, Inc. Helic, Inc. Huada Empyrean Software Co., Ltd
ICsense Imbera Electronics Oy IMEC
IN2FAB Technology Ltd. Innovative Silicon Inc. Integra Technologies LLC
IPextreme * Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) JSI Logistics
Kilopass Technology, Inc. King Yuan Electronics Corp. (KYEC) KLA-Tencor Corporation
Landshut Silicon Foundry GmbH (LFoundry) LingSen Precision Industries, Ltd. (LPI) LTX-Credence Corporation
Magma Design Automation, Inc. MASER Engineering B.V. Mentor Graphics Corporation
Microsoft Corporation MIPS Technologies, Inc. Mixel, Inc.
MOSIS MVTS Technologies NanGate Inc.
Novocell Semiconductor, Inc. Oracle PDF Solutions, Inc.
Posedge Inc. Powerchip Technology Corporation Presto Engineering Inc.
PSi Technologies, Inc. Rambus Inc. Rapid Bridge LLC
S3 Group SAP AG Satin IP Technologies
Scanimetrics, Inc. Semiconductor Manufacturing International Corp. (SMIC) Serus Corporation
Shanghai Hua Hong NEC Electronics Co., Ltd. (HHNEC) Shanghai Huali Microelectronics Corporation Sidense Corporation
Silansys Technologies Silicon Border Development LLC Silicon Turnkey Solutions
Silicon360 * Siliconware Precision Industries Co., Ltd. (SPIL) Siliconware USA, Inc. *
SiliconXpress SilTerra Malaysia Sdn. Bhd. Silvaco, Inc.
SOFICS BVBA Soitec Sonics, Inc.
Spirox Corporation STATS ChipPAC Ltd. * SVTC Technologies
Synopsys, Inc. * Taiwan Semiconductor Manufacturing Corporation (TSMC) * Tanner EDA
Teklatech A/S TELEFUNKEN Semiconductors GmbH & Co. KG Tensoft, Inc.
Teradyne, Inc. Test Advantage, Inc. Toppan Printing Co., Ltd. (Toppan Group)
TowerJazz True Circuits, Inc. Unisem Group
United Microelectronics Corporation (UMC) * United Test & Assembly Center Ltd. (UTAC) Vanguard International Semiconductor Corp. (VIS)
Verigy Ltd. VeriSilicon, Inc. * Virage Logic Corporation *
Wipro Technologies X-FAB Semiconductor Foundries AG Ziptronix, Inc.

Service Partner Members

Accenture Barclays Capital Battery Ventures L.P.
Bristlecone, Inc. Busch International Citi
DCM Deloitte LLP Deutsche Bank AG
Eda 2 Asic Consulting, Inc Enright Enterprise Consulting Solutions, LLC Ernst & Young
Evolutionary Operations Consulting LLC Flybridge Capital Partners Gardere Wynne Sewell LLP
Gartner GSR Ventures Heffernan Insurance Brokers
Hitachi Consulting Corporation InsideChips iSuppli Corporation
JDA Software Group, Inc. JPMorgan Chase & Co. KPMG LLP
MacroElite International Corp. Morgan Stanley N-Able Group International (NGi)
Needham & Company, LLC Pillsbury Winthrop Shaw Pittman LLP PricewaterhouseCoopers LLP (PwC)
PRTM (Pittiglio Rabin Todd & McGrath) Ross Research Semiconductor Operations Consulting
Shelton Group Silicon Valley Bank Financial Group (SVB Financial Group) Silicon-IP, Inc
Strategic Executive Search Group Tallwood Venture Capital Technology ConneXions (TCX, Inc.)
USJade Corp VLSI Research Inc Walden International
Wells Fargo Insurance Services

Industry Partner Members

Nokia Corporation

Organizations / Associations / Government & Educational Partner Members

Advanced Technology Investment Company (ATIC) ASTRI (Hong Kong Applied Science & Technology Research Institute Company Ltd.) Chinese American Semiconductor Professional Association (CASPA)
CSEM Swiss Center for Electronics and Microtechnology Defense Microelectronics Activity Dubai Silicon Oasis
Hellenic Semiconductor Industry Association (HSIA) Hong Kong Science & Technology Parks Corp. (HKSTP) Industrial Technology Research Institute (ITRI)
National Chip Implementation Center (CIC) The Wharton School, University of Pennsylvania Tsinghua University

Individual Partner Members

Castlemont Corporation National Central University

Membership Orientation

Click here for the GSA Membership Overview. The overview is an interactive Flash presentation with audio. The presentation is 6 MB and will take a moment to load.

The GSA Membership Overview covers the history and mission/vision of GSA, upcoming events, interest group charters and the many benefits of membership.

GSA welcomes your feedback on how we can better serve your needs. Thus, we have provided a simple satisfaction survey to examine these issues. To complete the survey, please go to https://www.gsaglobal.org/surveys/membership/. We appreciate your feedback.

For more information, please contact Lisa Tafoya at 1.888.322.5195 x 116 or ltafoya@gsaglobal.org.

Membership Survey

We would greatly appreciate your feedback in this important GSA satisfaction survey that will examine ways in which GSA can better serve your needs. We recognize that your time is valuable and thus have made the survey easy to complete.

The survey is administered in 5 sections. If one of the sections does not apply to you, you may choose to click "Skip this Section" to forego those questions pertaining to that section. Also, you may click on one of the links below to complete and submit that section only.

  • Communication
  • Events
  • Publications and Reports
  • Web site
  • Committees

We welcome input from both members and non-members. Thanks in advance for your feedback!

Click here to take the GSA Membership Survey!

Membership Testimonials

"GSA plays a vital role with the emergence and worldwide adoption of the outsourced semiconductor business model. The Alliance does an excellent job of identifying industry challenges as well as opportunities to help its membership collectively and individually succeed in today's competitive marketplace."
Dr. Craig H. Barratt, president and CEO, Atheros Communications

"I applaud GSA for its efforts in creating a platform for meaningful collaboration to enhance and facilitate semiconductor development," stated Lip-Bu Tan, President & Chief Executive Officer, Cadence Design Systems, Inc. "The resources provided by GSA help to keep us abreast of technical and market challenges facing the entire ecosystem. We see a tremendous potential for the growth of semiconductor businesses and continue to leverage our membership to build valuable partnerships."
Lip-Bu Tan, President & Chief Executive Officer, Cadence Design Systems, Inc.

"From its inception in 1994, GSA has worked to identify and articulate market opportunities and address issues of importance to the semiconductor industry. It provides forums for insight exchanges and collaboration while keeping our eco-system informed on those issues critical to achieving increased market-share and profit-margin goals."
Dr. Aart J. de Geus, Chairman & Chief Executive Officer, Synopsys, Inc.

"GSA offers its members a competitive edge by providing a wealth of market intelligence focused on the outsourced business model. The breadth and quality of the member cooperation coupled with unique tools and services, has earned GSA the reputation of being the primary semiconductor industry association of relevance."
Dr. Nicky Lu, Chairman & CEO Etron Technology, Inc.

"For the past 15 years, GSA has successfully played a vital role with the emergence and worldwide adoption of the outsourced business model. I have found that the GSA roundtables provide for an excellent platform to address and ultimately offer solutions to the increasingly complex issues of today, fueling potential to provide semiconductor growth and profitability. GSA has helped us to stay ahead of the curve and deliver on the promise of new wireless technologies."
Steve Mollenkopf, Executive Vice President & President, QUALCOMM CDMA Technologies (QCT)

"GSA's role has been vital to the emergence, adoption and dominance of the business model. Today, the organization is focused on addressing the challenges inherent in a complex value chain.  Its new role will be to reduce inefficiencies to ensure the long-term viability, growth and profitability of the semiconductor industry."
Dr. Dwight Decker, GSA Board Chairman

"Since 1994, the growth of the organization from a handful of companies to 500 members worldwide speaks to the value of the organization and its founding mission. This next phase in its evolution as the Global Semiconductor Alliance is an exciting time, as it continues to support the overall growth of the semiconductor industry alongside complementary organizations."
Wim Roelandts, President, Chief Executive Officer and Chairman, Xilinx, Inc.

"While I am a retired semiconductor executive, I am still very involved with GSA as its Director Emeritus. This organization has successfully moved past its original charter playing a vital role with the emergence and worldwide adoption of the fabless business model. The merits of this business model are well established with both fabless companies and integrated device manufacturers embracing production via dedicated foundries. However, there are still many issues that continue to be addressed. If challenges are not addressed and ultimately solved, it will threaten either the growth, profitability or both for this industry.

"From its inception, the GSA board, executive director and staff have worked to address issues of importance to our members. I would encourage all members to help keep us informed on issues of greatest importance. Together, we can be sure GSA remains a strong voice and a critical element in pursuit of a vibrant semiconductor industry."
Dr. Robert Pepper, GSA Director Emeritus

"The semiconductor wafer manufacturing landscape is shifting rapidly from the diverse 100 plus IDMs paradigm of the past to a highly concentrated bi-modal structure. Beginning at 90 nanometers, a dozen or so pure IDMs and a dozen or so foundry companies comprise the entire worldwide supply of mainstream bulk CMOS wafers. Driven by this trend and the breadth and quality of the member cooperation within GSA, it has emerged as the primary semiconductor industry association of relevance (addressing the enormous consequences of this trend)”.
Mike Hackworth, Chairman, Co-founder & Director, Cirrus Logic, Inc
Recipient of the 2001 Dr. Morris Chang Exemplary Leadership Award

For more information, please contact Nicole Tidwell at 1.888.322.5195 x 134 or ntidwell@gsaglobal.org.

Membership Application

The description below outlines the current governing terms for GSA Membership, and is posted on this Web site for member reference. These terms are subject to change. Current terms are as follows:

"Our company understands that signing up for GSA membership indicates an annual commitment for membership and we are obligated to pay the required dues within 30 days of receiving our initial invoice. It is also our obligation to communicate personnel changes to GSA for invoicing purposes. We understand this membership is renewed automatically each year. At renewal GSA may request updated information reflected within this application. We understand if payment for dues becomes delinquent for 15 days past the due date, our membership will be suspended. We understand this obligation remains, even if our company is acquired, as the new company will carry forward this obligation for the remainder of our annual membership term. We understand that cancellation of this membership must be submitted in writing to GSA and any dues remaining in our annual membership term will be payable to GSA. We understand that the terms of membership are subject to change and governing terms are listed on the GSA Web site www.gsaglobal.org."

Application Form

The GSA Membership Application consists of several forms. The forms are

  • Company Contacts
  • Executives
  • Company Description
  • Membership Interests
  • Company size and Membership Dues

These forms may be completed all at once or at individual sessions. All forms must be completed prior to submitting the GSA Membership Application.

To help with the application process, you will need to create a temporary username and password before you can login.

Assistance

Contact Nicole Tidwell (ntidwell@gsaglobal.org) or Denise Sciortino (dsciortino@gsaglobal.org) if you need any assistance with the GSA Membership Application.

New Applicant

Please fill out the following new applicant information to begin the GSA Membership Application process.
All fields are required.

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Applicant Login

Use the following Login to continue a GSA Membership Application. All forms must be completed prior to submitting the application.

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